Liquid Phase EpitaxyCrystal Growth

What is Liquid Phase Epitaxy?

Liquid Phase Epitaxy (LPE) is a refined crystal growth technique where semiconductor layers are deposited from a molten metal solution onto a crystalline substrate. This near-equilibrium process produces exceptionally pure crystals with low defect densities.

At MANULED, we've perfected this technique to manufacture high-performance AlGaAs infrared LED chips. Our controlled growth environment enables precise layer thickness and composition control at the atomic level.

850-940nm

Wavelength Range

<1%

Defect Density

±5nm

Layer Precision

LPE Crystal Growth furnace at MANULED - AlGaAs wafers undergoing epitaxial growth process

Temperature Control

±0.1°C

The LPE Manufacturing Process

Our four-stage process transforms raw materials into high-performance infrared LED chips through precise crystal engineering.

01

Substrate Preparation

High-purity GaAs wafers are meticulously cleaned and prepared to serve as the crystalline foundation for epitaxial growth.

02

Melt Preparation

Precise amounts of aluminum, gallium, and arsenic are combined in a graphite boat and heated to create a saturated melt solution.

03

Epitaxial Growth

The substrate is brought into contact with the melt. As temperature slowly decreases, atomic layers crystallize onto the wafer surface.

04

Layer Control

Multiple layers with varying compositions are grown sequentially to create the precise p-n junction structure required for LED operation.

Understanding Epitaxial Growth

We utilize both homoepitaxy and heteroepitaxy techniques to create optimized semiconductor structures for maximum LED performance.

Homoepitaxy

Growing epitaxial layers of the same material as the substrate (e.g., GaAs on GaAs). This maintains perfect lattice matching and produces the highest quality crystals.

Heteroepitaxy

Growing layers of different materials (e.g., AlGaAs on GaAs). This enables bandgap engineering to create efficient light-emitting structures with enhanced carrier confinement.

MANULED LED chip layer structure diagram showing epitaxial layers, contacts, and dimensions

Precision-Engineered Chip Structure

Each MANULED chip consists of multiple epitaxial layers grown with atomic precision. Our AlGaAs double heterostructure design maximizes carrier confinement and light extraction efficiency.

Active LayerAlGaAs p-n junction (850-940nm)
Top Contact14,000Å minimum gold metallization
Bottom Contact8,000Å minimum gold metallization
Chip Thickness254±50µm (10±2 mils)
Chip SizeCustomizable: 254µm - 1270µm

Experience the MANULED Difference

Request samples to evaluate our LPE-grown IR LED chips in your application, or contact our sales team to discuss custom specifications