Interactive 3D visualization tool for exploring U.S.-made IR LED bare-die chips from 850nm to 950nm. Configure die dimensions, inspect wafer layouts, and request samples.
3D Chip Visualizer
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Dimensions
Die size (square)254 µm · 10 mil
Thickness254 µm · 10 mil
Top pad Ø152 µm · 6 mil
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Your IR850 configuration will be attached. We'll reply with pricing and lead time.
Absolute maximum ratings must not be exceeded. Chip dimensions are customizable per customer design rules. Questions? sales@manuled.com